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INTEGRATED CIRCUITS
DATA SHEET
TEA0677T Dual pre-amplifier and equalizer for reverse tape decks
Product specification File under Integrated Circuits, IC01 August 1993
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
FEATURES * Head pre-amplifiers * Reverse head switching * Equalization with electronically switched time constants * 0 dB = 387.5 mV * Pin compatible to TEA0675 Dolby B, music search IC. GENERAL DESCRIPTION
TEA0677T
The TEA0677T is a monolithic bipolar integrated circuit intended for applications in car radios. It includes head and equalization amplifiers with electronically switchable time constants. Furthermore it includes electronically switchable inputs for tape drives with reverse heads. The device is intended to replace the regular TEA0675T in low-cost car radios using the same PCB. External components that are necessary for Dolby B and music search features can be omitted. The device will operate with power supplies in the range of 7.6 V to 12.0 V, output overload level increasing with increase in supply voltage. Current drain varies with supply voltage, so it is advisable to use a regulated power supply or a supply with a long time constant.
QUICK REFERENCE DATA SYMBOL VCC ICC (S + N)/N supply voltage supply current signal-plus-noise to noise ratio PARAMETER 7.6 - 68 MIN. 10 23 74 TYP. 12 26 - MAX. V mA dB UNIT
ORDERING INFORMATION EXTENDED TYPE NUMBER TEA0677T Note 1. SOT137-1; 1996 August 27. PACKAGE PINS 24 PIN POSITION SO MATERIAL plastic CODE SOT137A(1)
August 1993
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Instead of potentiometers at EQ AMP fixed resistors may be used. The value depends on applied heads.
Philips Semiconductors
Dual pre-amplifier and equalizer for reverse tape decks TEA0677T
Fig.1 Block and application diagram.
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
PINNING SYMBOL OUTA n.c. n.c. n.c. n.c. n.c. EQA EQFA VCC INA1 VREF INA2 INB2 HS INB1 GND EQFB EQB EQS n.c. ACUR n.c. n.c. OUTB PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION output channel A not connected not connected not connected not connected not connected equalizing output channel A equalizing input channel A supply voltage input channel A1 (forward or reverse) reference voltage input channel A2 (reverse or forward) input channel B2 (reverse or forward) head switch input input channel B1 (forward or reverse) ground equalizing input channel B equalizing output channel B equalizing switch input not connected auxiliary current not connected not connected output channel B
TEA0677T
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Head switching is achieved when pin 14 (HS) is connected to GND via a 27 k resistor (inputs INA2, INB2 active), or left open-circuit (inputs INA1, INB1 active). The 10 F capacitor at pin 14 sets the time constant for smooth switching.
Time constant switching for equalization (70 s/120 s) is achieved when pin 19 (EQS) is connected to ground via an 18 k resistor (120s) or left open-circuit (70 s).
August 1993
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL VCC VI tshort Tamb Tstg Ts Ves DC supply voltage input voltage (pin 1 to 24) except pin 11 (VREF) to VCC pin 11 (VREF) to VCC short-circuiting duration operating ambient temperature storage temperature soldering temperature (wave solder for 10 s at lead) electrostatic handling (note 1) PARAMETER 0 -0.3 - -40 -65 - - MIN.
TEA0677T
MAX. 16 VCC 5 +85 +150 260 - V V s C C C -
UNIT
Note to the Limiting values 1. Classification A: human body model; C = 100 pF, R = 1.5 k, V 2 kV; charge device model; C = 200 pF, R = 0 , V 500 V. CHARACTERISTICS VCC = 10 V; f = 20 Hz to 20 kHz; Tamb = +25 C; all levels are referenced to 387.5 mV (RMS; 0 dB) at output; see Fig.1; EQ switch in the 70 s position; unless otherwise specified. SYMBOL VCC ICC PARAMETER supply voltage supply current channel matching THD total harmonic distortion 2nd and 3rd harmonic head room at output PSRR CS CC RLmin Gv Voff IB REQ RI power supply ripple rejection channel separation crosstalk between active and inactive input minimum load resistance at output voltage gain (pre-amplifier) from input pins 10, 12, 13 and 15 to pin EQF input offset voltage input bias current equalizing resistor input resistance head inputs pins 10, 12, 13 and 15 connected to VREF f = 1 kHz; VO = 0 dB f = 1 kHz; VO = 0 dB f = 10 kHz; VO = 6 dB VCC = 7.6 V; THD = 1%; f = 1 kHz 0.25 V (RMS); f = 1 kHz; see Fig.3 f = 1 kHz; VO = +10 dB; 64 see Fig.4 f = 1 kHz; VO = +10 dB 70 f = 1 kHz; VO = 12 dB; THD = 1% f = 1 kHz 29 - - 4.7 60 30 2 0.1 5.8 100 31 - 0.4 6.9 - dB mV A k k 10 77 - - - dB k 70 - dB 45 50 - dB -0.5 - - 12 - 0.04 0.08 14 +0.5 0.1 0.15 - dB % % dB CONDITIONS - MIN. 7.6 10 23 TYP. MAX. 12 26 UNIT V mA
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
SYMBOL AV PARAMETER open-loop gain pins INA1/INA2 to pin OUTA pins INB1/INB2 to pin OUTB N equivalent noise voltage input (RMS value) (S+N)/N signal-plus-noise to noise ratio f = 10 kHz f = 400 Hz unweighted; 20 Hz to 20 kHz; Rsource = 0 internal gain 40 dB linear; CCIR/ARM weighted; see Fig.4 DC output voltage; pins 1 (OUTA) and 16 (OUTB) IOGND IOVCC ZO DC output current capability DC output current capability output impedance reference to VREF; tape head DC coupled to ground to VCC -2 300 - - - 80 - - 68 74 80 104 - 86 110 0.7 CONDITIONS MIN. TYP.
TEA0677T
MAX. - - 1.4
UNIT dB dB V
-
dB
0.15 - - 100
V mA A
Switching thresholds Equalization (pin 19) VEQS IEQ70 IEQ120 VIN1 IIN1 VIN2 IIN2 voltage at pin EQS 70 s input current 120 s input current inputs INA1 and INB1 active maximum input current inputs INA2 and INB2 active maximum input current note 1 - - -250 - - - 5 -150 -1000 V A A V A A
Head switch (pin 14) 0.65VCC 0.775VCC 1.0VCC -150 0.1VCC -50 90 -90 150 -150
0.225VCC 0.35VCC V
Note to the characteristics 1. For an application with a fixed EQ time constant of 120 s the equalizing network may be applied completely external. In this application the 8.2 k resistor has to be changed to 14 k and the internal resistor REQ = 5.8 k must be short-circuited by fixing the EQ-switch input at the 70 s position (pin 19; EQS left open-circuit). To activate the inputs INA1 and INB1 pin 10 (HS) may be left open-circuit. In this event the DC level at pin 10 (HS) is 0.775 VCC. General note It is recommended to switch off VCC with a gradient of 400 V/s at maximum to avoid plops on tape in the event of contact between tape and tape head while switching off.
August 1993
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Dual pre-amplifier and equalizer for reverse tape decks TEA0677T
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Dual pre-amplifier and equalizer for reverse tape decks TEA0677T
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEA0677T
Fig.5 PCB layout example.
August 1993
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
Table 1 Component list pcb layout example. VALUE 270 k 180 k 1.5 k 24 k 8.2 k 330 k 1 k 0.18 k 68 k to 1000 k 27 k 18 k 0 k 10 F 330 nF 100 nF 15 nF 4.7 nF 10 nF 0.47 nF 100 F
TEA0677T
COMPONENT R1, R11 R2, R12 R3, R13, R20 R4, R14 R5, R15 R6, R16 R7, R17 R8, R18 R9 R10 R19 R21, R22 C1, C11, C7, C17, C20 C2, C12 C3, C13 C4, C14 C5, C15 C6, C16 C8, C9, C18, C19 C10
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
PACKAGE OUTLINE SO24: plastic small outline package; 24 leads; body width 7.5 mm
TEA0677T
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
August 1993
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TEA0677T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
August 1993
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA0677T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1993
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